Investor Relations
Committed to becoming the Edge Sensing and Computing Gateway to the Physical World for Physical AI
For more than a decade, SENASIC has been deeply focused on Physical AI edge sensing and computing, dedicated to the R&D, design, and sales of high-performance chips. The company has built an end-to-end edge sensing and computing technology system that integrates sensing and acquisition, signal processing, and wireless transmission — precisely aligned with the industry trend of AI expanding into the physical world and edge intelligence scaling into real-world deployment.
Built on independently controlled core technologies and a full-stack, self-developed IP platform, SENASIC has established three core product lines: Universal Sensor Interface Chip, Intelligent Tire Sensing Chip, and Battery Monitoring Chip. These products are widely used across diverse high-growth sectors including energy storage, automotive, industrial electronics, and robotics.
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Prospectus
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Performance Report
Announcements & Notices
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- 2026-09-02
- Monthly Returns
Monthly Return of Equity Issuer on Movements in Securities for the month ended 31 August 2026
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- 2026-08-26
- Announcements and Notices
PROPOSED ADOPTION OF H SHARE INCENTIVE SCHEME AND PROPOSED ADOPTION OF H SHARE OPTION SCHEME FUNDED BY EXISTING SHARES
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- 2026-08-26
- Announcements and Notices
CHANGE OF REGISTERED SHARE CAPITAL AND AMENDMENTS TO THE ARTICLES OF ASSOCIATION
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- 2026-08-26
- Announcements and Notices
INTERIM RESULTS ANNOUNCEMENT FOR THE SIX MONTHS ENDED 30 JUNE 2026
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- 2026-08-14
- Announcements and Notices
DATE OF BOARD MEETING
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- 2026-08-06
- Monthly Returns
Monthly Return of Equity Issuer on Movements in Securities for the month ended July 31, 2026
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- 2026-07-29
- Monthly Returns
(Revised) Monthly Return of Equity Issuer on Movements in Securities for the month ended June 30, 2026
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- 2026-07-15
- Next Day Disclosure Returns
Next Day Disclosure Return